Beat the heat in 3-D chip stacks with ICECool

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22/09/2018

⏱ 1 min read

In the Moore’s Law race to keep improving computer performance, the IT industry has turned upward, stacking chips like nano-sized 3-D skyscrapers. But those stacks, like the law it’s challenging, have their limits, due to overheating. So, our team in New York, alongside colleagues in Zurich, received a 2013 contract to tackle intra-chip cooling from the Defense Advanced Research Projects Agency (DARPA) in its ICECool program. For our part, we developed a new cooling technology to overcome the thermal barrier of stacking chips, an on-chip solution that could help to even cool off entire datacenters….
Semiconductor Technology News – Semiconductor News, Semiconductors, Semiconductor Technology

Pavlos Papadopoulos

Pavlos Papadopoulos is a Senior Field Engineer and long-time technology enthusiast based in Thessaloniki, Greece. With over a decade of hands-on experience working with hardware, software, mobile devices, and real-world IT systems, he brings a practical, engineer-level perspective to every article he writes.A passionate smartphone user—especially within the Xiaomi ecosystem—Pavlos explores how apps, tools, and everyday technologies perform in real use. His interests span programming, web development, DIY tech projects, digital workflows, and productivity tools.He is also the founder and editor of three technology websites: Gadget Rumours, TheLatestTechNews, and TechnologyNews.info, where he has written and curated more than a thousand articles covering software, mobile tech, hardware, and emerging digital trends.Pavlos is committed to clear explanations, helpful guides, and honest, experience-based insights that help readers make better decisions about the technology they use every day.

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